发明名称 Semiconductor memory device and method for manufacturing the same
摘要 A semiconductor memory device includes a plurality of bit line structures arranged in parallel on a semiconductor substrate and having a plurality of bit lines and an insulating material surrounding the bit lines, an isolation layer formed in a portion in spaces between the bit line structures to define a predetermined active region and having substantially the same height as the bit line structures, a semiconductor layer formed in the predetermined active region surrounded by the bit line structures and the isolation layer and having substantially the same height as the bit line structures and the isolation layer, a plurality of word line structures arranged in parallel on the bit line structures, the isolation layer, and the semiconductor layer, and comprising a plurality of word lines and an insulating material surrounding the word lines, and source and drain regions formed in the semiconductor layer on either side of the word line structures.
申请公布号 US2005186728(A1) 申请公布日期 2005.08.25
申请号 US20050108929 申请日期 2005.04.18
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM JI-YOUNG
分类号 H01L23/52;H01L21/3205;H01L21/331;H01L21/8242;H01L27/02;H01L27/10;H01L27/108;H01L29/73;(IPC1-7):H01L27/10;H01L21/824 主分类号 H01L23/52
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