| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high yield peeling method for a laminated body which causes no damage to the laminated body, and a manufacturing method of a flexible semiconductor device. <P>SOLUTION: This manufacturing method of the semiconductor device comprises the first step of laminating a metal layer, an oxide layer, a layer formed of a raw material containing no hydrogen element, and a laminated body on a first substrate; the second step of forming a photocatalyst layer on the surface of a translucent substrate; and the third step of bonding the surface of the laminated body and the photocatalyst layer with a first adhesive after the first and second steps, carrying out the peeling at between the metal layer and the oxide layer, then casting light from the translucent substrate and separating the photocatalyst layer and the first adhesive at the interface between them, and removing the first adhesive. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
