| 发明名称 |
FORMING METHOD OF METAL FILM AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT HAVING BUMP |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide the forming method of a metal film with which a resist pattern with less deformation by heat and high anti-stress nature and an electrode is highly precisely formed even if the metal film is thick. <P>SOLUTION: A cured layer 2a is formed on the surface of the acrylic resist pattern 2 on a substrate 1 by using ultraviolet rays and electronic beams. The metal film is vapor-deposited from an upper part of the formed resist cured layer. The substrate is immersed in resist peeling liquid, and the unnecessary resist pattern and the metal film 4 on the resist pattern are removed. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
| 申请公布号 |
JP2005167011(A) |
申请公布日期 |
2005.06.23 |
| 申请号 |
JP20030404732 |
申请日期 |
2003.12.03 |
| 申请人 |
MURATA MFG CO LTD |
发明人 |
OE HIDEAKI;KANEKAWA TETSUYA |
| 分类号 |
H01L21/3205;H01L21/60;H01L21/768;H01L41/09;H01L41/22;H01L41/29 |
主分类号 |
H01L21/3205 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
