| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a board while sufficiently ensuring a surface area, even in a state that an electrode is provided on an end surface of the board. SOLUTION: A plurality of trench electrodes 6 extending from a rear surface 2B up to an intermediate position in a thickness direction toward a surface 2A are provided on the end surface 2C of a board 2, and a plurality of rear surface electrodes 7 connected respectively to the respective trench electrodes 6 are provided on the rear surface 2B of the board 2. When a module 1 is mounted to a mother board 9, these electrode 6, 7 are connected to the mother board 9 by a solder 8. Thus, as a circuit 4B and the like can be mounted to a fringe region of the surface 2A of the board 2 without being disturbed by a layout of the trench electrodes 6, the trench electrode 6 maintains a function as an end surface electrode forming a solder fillet 8A', while sufficiently ensuring a mounting area of the board 2, thereby forming the module part 1 compactly. COPYRIGHT: (C)2005,JPO&NCIPI
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