发明名称 |
Bipolar plate fabrication by roll bonding |
摘要 |
An anti-bonding material is placed in a desired pattern onto a first sheet of conductive material. A second sheet of conductive material is roll bonded with the first sheet of material. Fluid is injected between the bonded first and second sheets of material to expand the sheets of material at the desired pattern. A flow channel is formed at the desired pattern between the first and second sheet during fluid injection.
|
申请公布号 |
US2005133575(A1) |
申请公布日期 |
2005.06.23 |
申请号 |
US20030738402 |
申请日期 |
2003.12.17 |
申请人 |
GAYDEN XIAOHONG;CHEN YEN -LUNG;SIGLER DAVID R. |
发明人 |
GAYDEN XIAOHONG;CHEN YEN -LUNG;SIGLER DAVID R. |
分类号 |
B21D53/04;B23K20/10;B23K20/18;(IPC1-7):B23K31/02 |
主分类号 |
B21D53/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|