| 摘要 |
<p>An improved method of and apparatus for producing preferably thin plastic protective film layers for thin shiny copper foils and the like, as for PCB applications, with electric-charge adhering of the same to the foil and with peel-off releasable properties to provide the same original pristine, shiny copper foil surface without contamination, marring or other physical, chemical or other residue despite handling and other processing procedures.</p> |
