| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe pin incorporated in a probe card for inspecting a semiconductor, and suitable for inspecting a chip and an LSI package small and narrow in a pad size and a pitch. SOLUTION: In this probe pin, the probe pin 6 used for inspecting an electric characteristic of an inspected object is formed of a clad structure comprising an inner core material 1 with a tip part comprising a copper alloy and formed into a thin-tipped tapered shape 1a, and an outer coating material 2 comprising a metal material excellent in a spring characteristic for coating an outer circumferential face of the inner core material 1 excepting the thin-tipped tapered shape 1a of the inner core material 1. In the probe pin, a tip part of the outer coating material 2 is formed into a tapered shape 2a successive to the thin-tipped tapered shape 1a of the inner core material 1. COPYRIGHT: (C)2005,JPO&NCIPI
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