| 摘要 |
PROBLEM TO BE SOLVED: To reduce impurity contamination when specified processing is performed on a substrate using a processing liquid of alkaline solution. SOLUTION: When specified processing, e.g. etching, is performed using a specified processing liquid of alkaline solution, for example, onto a substrate at least the surface part of which is composed of silicon or a silicon oxide, the specified processing is performed by supplying a processing liquid of 10 wt% or more of alkaline solution containing thiocyanate to the substrate and causing metallic impurities dispersed into the processing liquid or metallic impurities adhering to the substrate after specified processing to react on thiocyanate. Since the metallic impurities are captured by reacting on thiocyanate, contamination of the substrate due to adhesion of metallic impurities can be suppressed. COPYRIGHT: (C)2005,JPO&NCIPI
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