发明名称 WIRE BONDING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To make formable a strong bending section in a wire just above a pressure-bonding ball, and to attain a low wire loop. <P>SOLUTION: A ball is pressure-bonded at a first bonding point A and a pressure-bonding ball 11 is formed. The ball 11 is moved in the opposite direction at a second bonding point B and a reverse operation is conducted. A capillary 5 is lowered slightly. The capillary 5 is elevated, and the capillary 5 is moved so that the underside 5a of the capillary 5 on the reverse side at the second point B in the direction of the second bonding point B is placed at the upper section of the ball 11. The capillary 5 is lowered, and the wire 4 is pushed on the ball 11 and a pressure-bonding wire 12 is formed. The capillary 5 is lifted, the wire is delivered, the capillary 5 is moved in the direction of the second bonding point B and the wire 4 is connected at the second bonding point B. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005019778(A) 申请公布日期 2005.01.20
申请号 JP20030183917 申请日期 2003.06.27
申请人 SHINKAWA LTD 发明人 MITSUI TATSUNARI;AKIYAMA SHINICHI
分类号 H01L21/60 主分类号 H01L21/60
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