VOLATILE COPPER(I) COMPLEXES FOR DEPOSITION OF COPPER FILMS BY ATOMIC LAYER DEPOSITION
摘要
The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process.
申请公布号
WO2004094689(A3)
申请公布日期
2005.01.20
申请号
WO2004US11734
申请日期
2004.04.16
申请人
E. I. DU PONT DE NEMOURS AND COMPANY;BRADLEY, ALEXANDER, ZAK;THOMPSON, JEFFERY, SCOTT
