| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of cleaning semiconductor manufacturing equipment by which even such a reaction product that attaches to a structural component which does not become hot when growing a crystal can be removed. SOLUTION: In the method of cleaning the semiconductor manufacturing equipment, the structural component 24 to which the reaction product attaches is removed out of the equipment, and then etching is conducted on the structural component 24 using a mixed liquid 30 of phosphoric acid and sulfuric acid, allowing the reaction product to be removed by etching even if it attaches to the structural component 24 which does not become hot during operation of the semiconductor manufacturing equipment 10. It is also possible to remove the reaction product attaching to the structural component 24 using only a phosphoric acid solution. However, by using the mixed liquid 30 of phosphoric acid and sulfuric acid for the etching process, an increase in viscosity of the phosphoric acid due to dehydration condensation can be somewhat suppressed, allowing the extension of the etching time. COPYRIGHT: (C)2005,JPO&NCIPI
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