发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To attain sure fuse welding by stably separating a fuse welding position from a conductive layer. SOLUTION: A fuse 3 provided with a fuse body 3A and two pads 3Ba, 3Bb connected by the fuse body 3A and two conductive layers 5A, 5B respectively connected to respective pads 3Ba, 3Bb are formed in a laminated structure on a semiconductor substrate. When the fuse 3 is welded by impressing electric stress between the two conductive layers 5A, 5B, the length of the fuse body 3A is regulated so that the welding part of the fuse 3 is located on a position in the fuse body 3A which is separated from an area superposed to the conductive layer 5A or 5B. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004304002(A) 申请公布日期 2004.10.28
申请号 JP20030096093 申请日期 2003.03.31
申请人 SONY CORP 发明人 MORI HIDEKI;EJIRI YOICHI;ASAMI KENJI;OONO AKIKAZU;YOSHITAKE NOBUYUKI
分类号 H01L21/3205;H01L21/82;H01L21/822;H01L23/52;H01L23/525;H01L27/04;(IPC1-7):H01L21/82;H01L21/320 主分类号 H01L21/3205
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