发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device having a shallow impurity region. SOLUTION: In the method for manufacturing a semiconductor device, a gate electrode part having a gate oxide film, a floating gate on the gate oxide film, a control gate on the floating gate, and an oxide formed by oxidizing the floating gate and the control gate is formed on a semiconductor. Impurities are then added to the semiconductor using the gate electrode part as a mask to form an impurity region having a depth of 0.1μm or less. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004297077(A) |
申请公布日期 |
2004.10.21 |
申请号 |
JP20040138077 |
申请日期 |
2004.05.07 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
YAMAZAKI SHUNPEI;TAKEMURA YASUHIKO |
分类号 |
H01L21/8238;H01L21/20;H01L21/8247;H01L27/092;H01L27/115;H01L29/78;H01L29/788;H01L29/792;(IPC1-7):H01L21/824;H01L21/823 |
主分类号 |
H01L21/8238 |
代理机构 |
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地址 |
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