<p>A method for polishing a wafer capable of effectively preventing the outer peripheral part of the wafer from sagging and a pad for polishing a wafer suitably used for the method of polishing the wafer, the method comprising the step of allowing the principal plane of the wafer to come into slidable contact with the polishing pad formed of nonwoven fabric soaked with resin to mirror-finish the surface, wherein the ratio of the surface roughness to the compressibility of the polishing pad [surface roughness Ra (µm)/compressibility (%)] is 3.8 or more.</p>
