| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device by which the reliability of the adhesion of a semiconductor chip to a package substrate can be improved. <P>SOLUTION: This method of manufacturing the semiconductor device includes a step of preparing a wiring board 2 having a main surface and a rear surface, a step of disposing a paste-like adhesive material 3 on the main surface of the wiring board 2, and a step of disposing the semiconductor chip 4 on the main surface of the wiring board 2 through the adhesive material 3. The method also includes a step of fixing the semiconductor chip 4 on the main surface of the wiring board 2 by curing the adhesive material 3. In the method, a dummy pattern 14 in which a plurality of cells is arranged in a grid pattern is formed in the semiconductor chip disposing area of the main surface of the wiring board 2. In addition, the paste-like adhesive material 3 is radially applied to the semiconductor chip disposing area of the wiring board 2 in the step of disposing the paste-like adhesive material 3. The application of the adhesive material 3 is performed by means of a dispenser having a plurality of nozzles. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
