| 摘要 |
A heat dissipating assembly includes a heat sink (120) attached on an electronic package (110), a fan (140) mounted to the heat sink, and an air guide device (20). The air guide device includes a duct (21) fixedly attached to a computer enclosure (40) at an air opening (42) thereof, and a hood (25) adjustably connected to the duct. The hood has a connection portion (26) adjustably connected to the duct, and a cover portion (29). The duct defines annular grooves (22) in an outer circumferential surface thereof, and the connection portion forms protrusions (28) on an inner surface thereof. The protrusions are engaged in selected annular grooves, to retain the hood on the duct at a desired position. The cover portion of the hood is near to and aligned with the fan. Heated air blown by the fan passes directly through the duct and out of the enclosure.
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