摘要 |
The invention relates to a card body (11, 30) comprising two plane-parallel surfaces (12, 13; 25, 26) and at least one electronic module (7, 17) that is embedded in the card body. The electronic module (7, 17) is positioned in an empty space (10, 32) of a body section (8) or between two films (14, 18) and a low-viscosity thermoplastic plastic is injected into said empty space (10) or between the two films (14, 18) at a comparatively low pressure. The electronic module (7, 17) is thus encapsulated, is embedded in the thermoplastic plastic once the latter has cured and is permanently bonded to the body section (8) or the two films (14, 18). |