| 摘要 |
PURPOSE: An epoxy resin composition for semiconductor device package is provided, to prevent the generation of crack between a pad face and a chip due to Pb free state in high temperature soldering and to reduce the adhesion of an epoxy packaging material and a wafer chip. CONSTITUTION: The epoxy resin composition comprises an o-cresol novolac epoxy resin of the formula 1; a diglycidyl ether bisphenol modified epoxy resin of the formula 2; a phenol novolac resin; a coupling agent obtained by pretreating the coupling agent represented by SiX3-(CH2)3-O-CH2R (wherein R is a cycloepoxy, amino, methacryl, mercapto or vinyl group, X's are identical or different one another and are a methoxy or ethoxy group) with glycols or distilled water; a coupling agent represented by SiX3-(CH2)3-O-CH2R; a curing accelerator; an inorganic filler; a brominated epoxy resin; antimony trioxide; and other additives. In the formulas 1 and 2, R is OH or CH3, G is a glycidyl group and n is an integer of 0-3; and in the formula 3, R is H or CH3, G is a glycidyl group and n is an integer of 0-3.
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