| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which is compact and capable of easily obtaining a higher heat dissipating effect by providing a metal layer between laminated semiconductor elements, and to provide a technique for a method of manufacturing the same. SOLUTION: As shown in the figure, the semiconductor device is equipped with a first semiconductor element 10 which is provided with a first surface and a second surface opposite to the first surface and contains a metal layer 13 located on the second surface, and a second semiconductor element 20 fixed on the second surface of the first semiconductor element 10. COPYRIGHT: (C)2004,JPO
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