TIN-COATED COPPER POWDER, METHOD OF PRODUCING THE TIN-COATED COPPER POWDER, AND ELECTRICALLY CONDUCTIVE PASTE OBTAINED BY USING THE TIN-COATED COPPER POWDER

摘要

PROBLEM TO BE SOLVED: To provide tin-coated copper powder of fine particles with a particle diameter of≤10μm which has excellent dispersibility, can be subjected to low temperature sintering, and also has low electric resistance. SOLUTION: The tin-coated copper powder for forming a conductor of a printed circuit board is obtained by using particles of copper powder as a core material, and providing the surfaces of the particles with a tin-coated layer. The particles of the copper powder in which the value of a weight cumulative particle diameter D50measured by using a laser diffraction scattering type particle size distribution measuring apparatus is 0.1 to 10μm are used as the core material, and the surface of the particles of the copper powder are provided with the tin-coated layer of 0.1 to 5.0wt.%. COPYRIGHT: (C)2004,JPO