| 摘要 |
PROBLEM TO BE SOLVED: To hold/release a substrate by a holding member with a simple constitution, and to switch a state of holding/releasing the substrate and a state of maintaining a holding state or a releasing state. SOLUTION: A substrate treatment device comprises a spin chuck 1 which is rotated while holding a wafer W, a plurality of holding pins 21 for holding/releasing the wafer W, and an interlocking mechanism to interlock the operations of the plurality of holding pins 21 with the rotation of the spin chuck 1. The interlocking mechanism comprises a cam member 30 having a cam surface 31 uneven in a direction parallel to a rotary shaft 12 of the spin chuck 1, a cam follower 25 to be vertically moved when moved on the cam surface 31 as the spin chuck 1 is rotated, and an operation conversion mechanism 20 to convert the operation of the cam follower 25 into the holding/releasing operation of the holding pins 21. By vertically moving the cam member 30, the interlocking/non-interlocking of the rotation of the spin chuck 1 with the operation of the holding pins 21 can be switched. COPYRIGHT: (C)2004,JPO |
