| 摘要 |
<p>A laser processing method capable of promoting the clearance of substances removed from a work piece to be processed during processing so as to enhance processing capability. From one side (front face (2a)) of a work piece (2) to be processed through which work piece laser light can be transmitted, very short pulse laser light (L) is applied to the work piece (2). The very short pulse laser light (L) applied is transmitted through the one side (front face (2a)) of the work piece (2) to be processed and condensed on the other side (rear face (2b)), and the work piece (2) is processed from the face or vicinity of the face on the other side (rear face (2b)).</p> |
