发明名称 HEAT-CONDUCTIVE POLYMER MOLDING AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a heat-conductive polymer molding which can exert excellent thermal conductivity. SOLUTION: This heat-conductive polymer molding is molded of a heat-conductive composition in which a heat-conductive filler of 5-800 pts.wt. is mixed with a liquid crystalline polymer of 100 pts.wt. In the heat-conductive polymer molding, the liquid crystalline polymer is magnetically oriented in a heat-conduction direction. Preferably, the liquid crystalline polymer is at least one kind of (A) thermal liquid-crystalline wholly-aromatic polyester and (B) a thermal liquid-crystalline wholly-aromatic polyesteramide. In addition, preferably, the heat-conductive polymer molding is formed like a sheet, and its width-direction thermal conductivity (λ<SB>T</SB>) is set at 1.0-50 W/(m×K). COPYRIGHT: (C)2004,JPO
申请公布号 JP2004050704(A) 申请公布日期 2004.02.19
申请号 JP20020213050 申请日期 2002.07.22
申请人 POLYMATECH CO LTD 发明人 HIDA MASAYUKI;KIMURA TORU;SHIMOYAMA NAOYUKI;ISHIGAKI TSUKASA
分类号 C08J5/00;B29C45/00;B29K67/00;B29K105/14;B29L7/00;C08K3/00;C08L67/03;C08L77/12;C08L101/00;H01L23/373;(IPC1-7):B29C45/00 主分类号 C08J5/00
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