| 摘要 |
Connecting arrangement (100) comprises: (a) an integrated electronic component (50) with contact surfaces (52, 54, 56, 58, 60) electrically insulated from each other; (b) a switching circuit support (10) with counter contact surfaces facing the contact surfaces; and (c) electrically conducting connections (102, 104, 106, 108, 110) made from conducting adhesive or conducting lacquer between each contact surface and its counter contact surface. The intermediate chamber between each contact surface and its counter contact surface is free from a solder layer. An Independent claim is also included for a process for the production of the connecting arrangement. |
