发明名称 METHOD FOR FILLING THROUGH HOLE OF CERAMIC GREEN SHEET WITH CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To reduce ruggedness on the exposed surface of conductive paste with which a through hole of a ceramic green sheet is filled and to improve the electric connection reliability and mechanical connection reliability of a through conductor obtained by sintering the conductive paste. SOLUTION: The ceramic green sheet 1 in which the through hole 2 is formed is put on a porous undersheet 3 containing fluororesin at least at an upper surface layer. While sucking the green sheet 1 from the lower surface side through the under sheet 3, the conductive paste 4 is charged from the upper surface side of the green sheet 1 into the through hole 2, and then the undersheet 3 is removed from the green sheet 1. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004031817(A) 申请公布日期 2004.01.29
申请号 JP20020188458 申请日期 2002.06.27
申请人 KYOCERA CORP 发明人 TAMANE YASUYUKI;IZUMI HIROKI
分类号 B28B11/00;H05K3/40;H05K3/46;(IPC1-7):H05K3/40 主分类号 B28B11/00
代理机构 代理人
主权项
地址