| 摘要 |
<p>A process for producing a chip board with compressed upper and lower layers and a porous middle layer, comprises forming an adhesive mixture composed of an adhesive and particles. The adhesive mixture is applied to the edges of the board, and the edges are smoothed off after the adhesive mixture has bound. The adhesive is a polyvinylalcohol (PVA) and the particles consist of wood shavings and/or saw dust.</p> |
