发明名称 METHOD AND APPARATUS FOR MEASURING THICKNESS OF COATING FILM AND MANUFACTURING METHOD FOR COATING FILM FORMATION MEMBER
摘要 <P>PROBLEM TO BE SOLVED: To provide a contactless measurement method and a measuring apparatus for stably and accurately measuring the thickness distribution of a wet coating film immediately after its formation even if the surface of a substrate is irregular, and to provide a manufacturing method for a film formation member using the apparatus and the method as well as for a member for plasma display. <P>SOLUTION: In the measurement method for the thickness of a coating film, the height of a substrate surface before forming the film at an arbitrary position X in a direction in parallel with the substrate surface is set to be Ha (x) and the height of the substrate surface after the film is formed is set to be Hb (x), and the thickness of the film is obtained from the difference between the heights. In the measurement method, when the average value of the height of the substrate surface before the film is formed at least at two locations within a fixed range from a position X is set to be Ham (x) and the average value of the height of the substrate surface after the film is formed at least at two locations within a fixed range from the position X is set to be Hbm (x), the thickness of the film is obtained by using the Ham (x) and Hbm (x) as the Ha (x) and Hb (x), respectively. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003344038(A) 申请公布日期 2003.12.03
申请号 JP20020158799 申请日期 2002.05.31
申请人 TORAY IND INC 发明人 OGAWA KOJI;SAKUMA ISAMU;KITAMURA YOSHIYUKI
分类号 G01B21/08;B05C5/02;B05C11/00;B05D1/26;B05D3/00;G01B11/06;G03F7/16;H01J9/02;H01J9/42;H01J11/22;H01J11/34;H01J11/36 主分类号 G01B21/08
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