发明名称 ELECTRONIC PARTS DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To enhance a sealing ability and reliability of a circuit board storing space by filling a potting material in the space between a resin material of a resin circuit board and interconnecting wires. <P>SOLUTION: In a base plate 2 of a transmission 1, there are provided a circuit board 4 for driving an actuator 19 or the like and a resin circuit board 5 where bus bar 9 is buried within a resin compact 6. The circuit board 4 is sealed up inside the circuit board storing space 7 by means of a seal ring 12 and a cover plate 13. In a potting material filling hole 8 of the resin circuit board 5, the potting material 14 is filled which contacts closely with an exposed portion of the bus bar 9 and the resin compact. Thereby, even when a minute clearance is produced in a contact surface S of the resin compact 6 with the bus bar 9, the clearance can be sealed with the potting material 14, so that extraneous substances such as oil liquid, moisture or the like can be prevented from infiltrating into the circuit board storing space 7 along the contact surface S. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2003318568(A) 申请公布日期 2003.11.07
申请号 JP20020121028 申请日期 2002.04.23
申请人 HITACHI UNISIA AUTOMOTIVE LTD 发明人 WADA OSAMU
分类号 H05K5/06;H02G3/16;(IPC1-7):H05K5/06 主分类号 H05K5/06
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