| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for filling through-holes of a printed wiring board which have a small diameter and a high aspect ratio without any defect, and a method for filling the holes of the printed wiring board with the resin composition. SOLUTION: The composition for filling through-holes comprises an epoxy resin having two or more epoxy groups in the molecule, an acid anhydride, an acrylate monomer and/or oligomer, a latent curing accelerator for the epoxy resin, a photoradical initiator, and a filler as the essential components, and the mixing ratio of the acid anhydride to the epoxy resin (as the acid anhydride equivalent weight number to the epoxy equivalent weight number) is 0.8-1.2, and the mixing ratio of the latent curing accelerator, that of the photoradical initiator, and that of the filler are 0.1-10 pts.wt., 0.01-3 pts.wt., and 50-600 pts.wt., respectively, based on 100 pts.wt. sum of the epoxy resin, the acid anhydride, and the acrylate monomer and/or oligomer. The method comprises filling the composition into the through-holes, and then irradiating the composition with UV-rays to thicken the composition, and subsequently heat curing the thickened composition. COPYRIGHT: (C)2004,JPO
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