MULTILAYER WIRING BOARD, BASE FOR MULTILAYER WIRING BOARD, PRINTED WIRING BOARD, AND ITS MANUFACTURING METHOD

摘要

A base for multilayer wiring boards in which a conductive layer (112) forming a wiring pattern is provided on one side of an insulating base (insulating resin layer (111)), and an adhesive layer (113) for interlayer adhesion is provided on the other side, and a through hole (114) extending through the conductive layer, the insulating base, and the adhesive layer is filled with a conductive resin composition (115) for interlayer electrical connection. The diameter of the conductive layer portion (114b) of the through hole is smaller than those of the insulating base portion and the adhesive layer portion (114a). The electrical connection between the conductive resin composition and the conductive layer is ensured through the back (112a) of the conductive layer.