| 摘要 |
A protective tape is applied to a surface of a wafer supported by a chuck table. A blade tip of a cutter unit is inserted into a groove formed in the chuck table circumferentially of the wafer, to cut the protective tape to have a larger diameter than the wafer. The wafer with the protective tape applied thereto undergoes a back grinding process. Subsequently, in a separating step, the protective tape is separated by means of a separating tape applied to the surface of protective tape. <IMAGE> |
