发明名称 PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a reliable printed wiring board and a manufacturing method therefor, capable of wiring in high density even near a land with a teardrop. SOLUTION: Left and right teardrops 40A and 40B are formed to a land 32 which can assure sufficient insulation interval from a line. Meanwhile, to a land 30 close to lines 24 and 26, a teardrop 40B of side angle 30°is fitted on the left side in the figure while a teardrop 44A of side angle 50°is fitted on the right side. By fitting a small, or large side angle, teardrop 44A on the right side of the land 30, two lines 24 and 26 can be disposed between the land 30 and the land 32. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003179318(A) 申请公布日期 2003.06.27
申请号 JP20020299893 申请日期 2002.10.15
申请人 IBIDEN CO LTD 发明人 MURAKAMI HIDEHIKO;TAKENAKA TOSHIAKI
分类号 H05K1/02;H05K3/00;H05K3/34;(IPC1-7):H05K1/02 主分类号 H05K1/02
代理机构 代理人
主权项
地址