| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for use as a solder resist, which is free from anti-tackiness and excellent in heat resistance, flexibility and adhesiveness without other film properties being sacrificed, and can be designed so as to obtain properties in conformity with the end use thereof, and to provide a printed wiring board using the composition. <P>SOLUTION: In the photosensitive resin composition comprising (A) an active energy ray-curable resin having at least two ethylenically unsaturated linkages per molecule, (B) a photopolymerization initiator, (C) a diluent and (D) a thermosetting compound; wherein the (A) comprises a resin which is obtained by a process wherein an epoxy compound is successively reacted with an unsaturated monocarboxylic acid and with a polybasic acid to form a compound, which is then allowed to react with an epoxy resin to obtain the resin. <P>COPYRIGHT: (C)2003,JPO |
