| 摘要 |
A technique for eliminating electrically conductive vias is disclosed. In one embodiment, the technique is realized as an improved multilayer circuit board for eliminating electrically conductive vias. The multilayer circuit board has a top layer and a buried layer separated by at least one dielectric layer, wherein the buried layer includes an electrically conductive power plane portion and an electrically conductive ground plane portion. The improvement comprises a cavity in the multilayer circuit board extending through the top layer and the at least one dielectric layer so as to expose at least a portion of the power plane portion and the ground plane portion of the buried layer within the cavity. The cavity is sized to accommodate an electronic component therein such that the electronic component makes electrical contact with the exposed portion of the power plane portion and the ground plane portion of the buried layer, thereby eliminating the need for electrically conductive vias electrically connected to the power plane portion and the ground plane portion of the buried layer.
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