发明名称 |
Packaging high power integrated circuit devices |
摘要 |
The invention provides a method and apparatus for electrically connecting the die of a high power semiconductor device to a substrate with a conductive strap such that the connection is resistant to the shear stresses resulting with changes in temperature. In one embodiment, the method includes providing a substrate having first and second portions that are electrically isolated from each other. A semiconductor die having top and bottom surfaces and one or more active electronic devices formed therein is also provided. The device has a first terminal connected to a first conductive layer on the bottom surface of the die, and a second terminal connected to a second conductive layer on the top surface of the die. The first conductive layer is electrically coupled to a top surface of the first portion of the substrate. The second conductive layer is electrically coupled to the second portion of the substrate with a metal strap.
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申请公布号 |
US2003075785(A1) |
申请公布日期 |
2003.04.24 |
申请号 |
US20020256905 |
申请日期 |
2002.09.26 |
申请人 |
AMKOR TECHNOLOGY, INC. |
发明人 |
CROWLEY SEAN T.;GILLETT BLAKE A.;BOLAND BRADLEY D.;MAURI PHILIP S.;BELMONTE FERDINAND E.;BURRO REMIGIO V.;AQUINO VICTOR M. |
分类号 |
H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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