CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING

摘要

An article (205) of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article (205) of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface (510) adapted to polish the substrate and a mounting surface (530). A plurality of perforations (505) may be formed in the polishing article (205) for flow of material therethrough. In another aspect, a polishing article (205) for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.