发明名称 |
METHOD OF MANUFACTURING THICK FILM TYPE THERMAL HEAD AND THICK FILM TYPE THERMAL HEAD |
摘要 |
PROBLEM TO BE SOLVED: To provide a thick film type thermal head capable of facilitating high resolution, improving image quality and lowering consumption of power. SOLUTION: An electrode pattern including a common electrode 2 and a plurality of grounding side lead conductors 4 are formed on a substrate. A resist is formed on the electrode pattern and at least one opening section whereby end sections of the grounding side lead conductors 4 at the side opposite to the common electrode 2 and end sections of power source side lead conductors 3 at the side opposite to the grounding side lead conductors 4 are exposed, is formed on the resist by each individual electrode. A heating resistor material is filled in the opening sections to form heating resistors 1 connected to the power source side lead conductors 3 and the grounding side lead conductors 4.
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申请公布号 |
JP2003118154(A) |
申请公布日期 |
2003.04.23 |
申请号 |
JP20010313552 |
申请日期 |
2001.10.11 |
申请人 |
GRAPHTEC CORP |
发明人 |
SHIRAKI MASATO;TOYOSAWA TAKESHI |
分类号 |
B41J2/335;(IPC1-7):B41J2/335 |
主分类号 |
B41J2/335 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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