| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for cleaving a semiconductor wafer and a semiconductor wafer, which readily enables the formation of an orientation flat by cleavage, and reduces the fracture of wafer, which occurs in a manufacturing process, by suppressing the strength degradation of the wafer. SOLUTION: A notched groove is formed on the rim of the semiconductor wafer so as to have a depth not piercing through the wafer. Cleavage is started from the notched groove.
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