发明名称 Method of manufacturing a semiconductor device
摘要 The efficiency of an underfill sealing work is to be improved. A projection is formed adjacent an inner periphery wail of a recess of a ceramic substrate and a nozzle is disposed so as to overhang corners of a first face of the projection. Thereafter, resin is dropped from the nozzle onto the corners of the projection, whereby the resin flows down along the corners onto a resin passage. After passing the resin passage, the resin is admitted between a bottom of the ceramic substrate and a driver to effect underfill sealing. Positioning the nozzle above the corners of the projection can be controlled relatively easily, so that the underfill sealing work is no longer troublesome and the efficiency thereof can be improved.
申请公布号 US2003064549(A1) 申请公布日期 2003.04.03
申请号 US20020247505 申请日期 2002.09.20
申请人 HITACHI, LTD. 发明人 SAITOU TAKAKI
分类号 H01L21/56;H01L23/13;(IPC1-7):H01L21/48 主分类号 H01L21/56
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