| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable semiconductor device which enables to test a wiring substrate for continuity easily and reliably. SOLUTION: The wiring substrate 20 is such that a pattern 12 for plating is formed in a lattice, and a wiring pattern 10 is formed in connection to the pattern for plating for each unit region demarcated by the pattern for plating. On such a wiring substrate 20, a semiconductor element 32 is mounted by electrically connecting to the wiring pattern, and the surface where the semiconductor element is mounted is entirely sealed with a resin to fabricate a semiconductor device. In a method of manufacturing the semiconductor device, a dividing recess 30 of such a depth as to divide at least the pattern for plating and the wiring pattern is formed in the wiring substrate 20 formed with the pattern 12 for plating and the wiring pattern 10, along the edge of the pattern 12 for plating and perpendicularly to the wiring pattern 10. Then, the semiconductor element 32 is mounted on the wiring substrate 20, and the surface whereon the semiconductor element is mounted is entirely sealed with the resin 34. The wiring substrate 20, together with the sealing resin 34, is divided by the unit region to obtain respective semiconductor devices.
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