| 摘要 |
A ball grid array (BGA) package provides a constant internal voltage via an auxiliary routing configuration of a printed circuit board (PCB). The BGA package includes a substrate having an opening, a plurality of pads attached to an upper surface of the substrate, a semiconductor chip which has a plurality of bonding pads and which is attached to a lower surface of the substrate, an internal connection mechanism for connecting at least one of the bonding pads to at least one of the plurality of pads via the opening, and a filling material for filling the opening to protect the bonding pads and the internal connection mechanism. At least one of the plurality of bonding pads is electrically connected to at least one other of the plurality of bonding pads via an auxiliary routing configuration within the substrate. |
