SEMICONDUCTOR MODULE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To inexpensively and highly reliably provide a semiconductor module that is low in heat resistance and high in added value. SOLUTION: The product of the modulus of longitudinal elasticity and thickness of the heat radiating fin of this semiconductor module is adjusted to the threefold of the product of the modulus of longitudinal elasticity and thickness of a conductive layer or smaller, by using a material having a larger coefficient of linear expansion than the conductive layer has for the fin. A space is provided between the microcomputer mounting position of a circuit board and the fin. At the time of manufacturing the fin, press work is performed by using a pressure die paired with the fin.