首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Thin structure information processing apparatus
摘要
申请公布号
EP0985997(B1)
申请公布日期
2003.01.15
申请号
EP19990123913
申请日期
1997.07.03
申请人
FUJITSU LIMITED
发明人
SHIN, TAKAHIRO;OHNISHI, MASUO
分类号
G06F1/16;(IPC1-7):G06F1/16
主分类号
G06F1/16
代理机构
代理人
主权项
地址
您可能感兴趣的专利
ADHESIVE VENT PAD FOR A BATTERY MODULE
METHOD FOR APPLYING AN ORGANIC SEMICONDUCTOR LAYER BASED ON EPINDOLIDIONE TO A CARRIER
MAGNETORESISTIVE EFFECT ELEMENT, MANUFACTURING METHOD OF MAGNETORESISTIVE EFFECT ELEMENT, AND MAGNETIC MEMORY
THERMAL ENERGY HARVESTING FOR DISPENSING SYSTEM
P-CONTACT WITH MORE UNIFORM INJECTION AND LOWER OPTICAL LOSS
SOLAR CELL MODULE MANUFACTURING METHOD
SOLAR CELL AND SOLAR CELL MODULE
USE OF METAL PHOSPHORUS IN METALLIZATION OF PHOTOVOLTAIC DEVICES AND METHOD OF FABRICATING SAME
SEMICONDUCTOR FILM, TRANSISTOR, SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND ELECTRONIC APPLIANCE
Array Substrate, Method for Fabricating the Same and Display Device
Semiconductor Device Comprising a Bipolar Transistor
MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS
METHOD OF FORMING SPACERS FOR A GATE OF A TRANSISTOR
INTEGRATED PHOTONICS INCLUDING GERMANIUM
DISPLAY DEVICE
ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD OF MAKING SAME
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
THREE-DIMENSIONAL INTEGRATED STRUCTURE COMPRISING AN ANTENNA CROSS REFERENCE TO RELATED APPLICATIONS
PACKAGE CARRIER