Lead frame for assembly for thin small outline plastic encapsulated packages

摘要

A lead frame for the assembly of thin small outline packages incorporating a semiconductor circuit is provided in a generally rectangular form including a plurality of conductive leads opposing one another about the longitudinal sides of the lead frame and a die mounting portion centered therebetween. In addition, a pair of leads is provided at the distal ends of the lead frame which are stamped in a general "S" shape. These stamped leads extend downwardly from the lead frame and are within the footprint of the lead frame. The footpads of these additional leads remain exposed as the lead frame is encapsulate in a plastic molded package and are level with the bottom of the molded package.