| 摘要 |
Providing a semiconductor module comprising a plurality of semiconductor elements, in which wiring lengths of the semiconductor elements juxtaposed to each other are approximately the same. A semiconductor module comprising a lower layer substrate and an upper layer substrate, in which a first and a second electrode pads formed in a front surface of the lower layer substrate are connected with a first and a second wires by a first and a second bridge wires disposed in a back surface of the upper layer substrate.
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