发明名称 METHOD FOR MANUFACTURING CONDUCTIVE BEAD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing conductive beads where plating treatment is applied to the surface of glass microbeads or resin microbeads to improve adhesion between the resultant metal film and the beads. SOLUTION: In the method for manufacturing the conductive beads, beads composed of the glass microbeads or resin microbeads are surface-treated using a silane coupling agent having at least one functional group selected from a mercapto group, amino group, cyano group, amide group and ureido group, thereafter immersed in a solution in which fine metal particles are dispersed, and then dispersed by an ultrasonic wave and dried, by which the fine metal particles are allowed to adhere to the beads. Then plating treatment is applied to the surface of the beads using the fine metal particles as nuclei by an electroless plating method.
申请公布号 JP2002121679(A) 申请公布日期 2002.04.26
申请号 JP20000313541 申请日期 2000.10.13
申请人 MITSUBOSHI BELTING LTD 发明人 IZUMOTO MASAHIRO;IGARASHI TETSUYA;KURODA KOTARO;HAYASHI SHIGEHIKO
分类号 C23C18/31;C23C18/18;H01B13/00;(IPC1-7):C23C18/31 主分类号 C23C18/31
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