| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for depositing a metal layer with an electric plating containing void-free in a feature. SOLUTION: This method and associated apparatus contains a step for depositing the metal on the plated surface of an object immersed into electrolyte solution, and then performing a bulk deposition on the plated surface. In one aspect, the above method contains a step, in which the concentration of metal ions in the electrolyte solution contained in the feature on the plating surface is enhanced by impressing the voltage between an anode and the plating surface, and then the bulk deposition on the plated surface is performed. |
