| 发明名称 |
Seed repair and electroplating bath |
| 摘要 |
Disclosed are compositions useful for repair and electroplating of seed layers. Also disclosed are methods of repairing and electroplating such seed layers.
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| 申请公布号 |
US2002043468(A1) |
申请公布日期 |
2002.04.18 |
| 申请号 |
US20010976422 |
申请日期 |
2001.10.12 |
| 申请人 |
SHIPLEY COMPANY, L.L.C. |
发明人 |
MIKKOLA ROBERT D.;CALVERT JEFFREY M. |
| 分类号 |
C25D3/00;C23C18/38;C25D3/02;C25D3/38;C25D5/48;C25D5/52;C25D7/12;C25D11/32;H01L21/288;H01L21/768;(IPC1-7):C25D11/32 |
主分类号 |
C25D3/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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