| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliability-improved head assembly capable of preventing the falling of broken pieces onto a magnetic disk surface even when chipping, cracking or the like occurs in a head amplifier IC in manufacturing process. SOLUTION: A trace 20 having a wiring pattern is provided on the arm and the suspension 14 of this head suspension assembly. A slider having a magnetic head, and a head amplifier IC 18 are mounted on the wiring pattern. Between the head amplifier IC and the wiring pattern, an underfill is filled, and the outer surface of the head amplifier IC is covered with the same resin of the underfill.
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