| 摘要 |
<p>A UV laser cuts ceramics or glasses such as the alumina or ceramic of sliders (10), and particularly separates rows or sliders or rounds edges. A preferred process entails covering the surfaces of wafers, rows, or sliders with a sacrificial layer; removing a portion of the sacrificial layer to create uncovered zones along existing edges or over intended edges; laser cutting wafers into rows or rows into sliders; laser rounding edges, and/or corners; cleaning debris from the uncovered zones; and removing the sacrificial layer. Although a preferred laser is a Q-switched, UV solid-state laser providing imaged and/or shaped output at a bite size of between about 1 to 7 νm, other lasers including excimers can be employed.</p> |
